LM75BD
vs
TCN75-5.0MOA713
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TELCOM SEMICONDUCTOR INC
|
Package Description |
3.9MM, PLASTIC, SOP -8
|
SOIC-8
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
NXP
|
|
Accuracy-Max (Cel) |
3 Cel
|
|
Body Breadth |
3.9 mm
|
|
Body Height |
1.75 mm
|
|
Body Length or Diameter |
4.9 mm
|
|
Housing |
PLASTIC
|
|
JESD-609 Code |
e4
|
|
Mounting Feature |
SURFACE MOUNT
|
|
Number of Bits |
11
|
|
Number of Terminals |
8
|
|
Operating Current-Max |
5 mA
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Output Interface Type |
2-WIRE INTERFACE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape/Style |
RECTANGULAR
|
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
2.8 V
|
|
Surface Mount |
YES
|
|
Terminal Finish |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
|
Termination Type |
SOLDER
|
|
Base Number Matches |
1
|
2
|
|
|
|
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