LM747J/883 vs LM747J feature comparison

LM747J/883 National Semiconductor Corporation

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LM747J Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 1.5 µA 1.5 µA
Bias Current-Max (IIB) @25C 0.5 µA
Common-mode Reject Ratio-Min 70 dB
Common-mode Reject Ratio-Nom 70 dB 90 dB
Frequency Compensation YES
Input Offset Voltage-Max 6000 µV 6000 µV
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 19.43 mm 19.43 mm
Low-Offset NO
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Nom 0.2 V/us
Supply Current-Max 6.6 mA
Supply Voltage Limit-Max 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Unity Gain BW-Nom 250
Voltage Gain-Min 25000
Width 7.62 mm 7.62 mm
Base Number Matches 3 4

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