LM747J/883
vs
LM747J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP,
Pin Count
14
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
1.5 µA
1.5 µA
Bias Current-Max (IIB) @25C
0.5 µA
Common-mode Reject Ratio-Min
70 dB
Common-mode Reject Ratio-Nom
70 dB
90 dB
Frequency Compensation
YES
Input Offset Voltage-Max
6000 µV
6000 µV
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Length
19.43 mm
19.43 mm
Low-Offset
NO
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Nom
0.2 V/us
Supply Current-Max
6.6 mA
Supply Voltage Limit-Max
22 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Unity Gain BW-Nom
250
Voltage Gain-Min
25000
Width
7.62 mm
7.62 mm
Base Number Matches
3
4
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