LM7372MR vs MC33074ADR2 feature comparison

LM7372MR National Semiconductor Corporation

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MC33074ADR2 Motorola Semiconductor Products

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code SOIC
Package Description PLASTIC, SOP-8 SOP,
Pin Count 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 12 µA 0.7 µA
Bias Current-Max (IIB) @25C 10 µA
Common-mode Reject Ratio-Nom 90 dB 97 dB
Frequency Compensation YES
Input Offset Voltage-Max 10000 µV 5000 µV
JESD-30 Code R-PDSO-G8 R-PDSO-G14
JESD-609 Code e0
Length 4.93 mm 8.65 mm
Low-Bias NO
Low-Offset NO
Micropower NO
Moisture Sensitivity Level 3
Neg Supply Voltage Limit-Max -18 V -22 V
Neg Supply Voltage-Nom (Vsup) -5 V -15 V
Number of Functions 2 4
Number of Terminals 8 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.75 mm
Slew Rate-Nom 700 V/us 10 V/us
Supply Current-Max 19 mA 11.2 mA
Supply Voltage Limit-Max 18 V 22 V
Supply Voltage-Nom (Vsup) 5 V 15 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 100000 4500
Voltage Gain-Min 1000 25000
Wideband YES
Width 3.94 mm 3.9 mm
Base Number Matches 3 3
Common-mode Reject Ratio-Min 80 dB
Slew Rate-Min 8 V/us

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