LM7322MA/NOPB
vs
MCP631-E/MNY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DFN
Package Description
SOP, SOP8,.25
HVSON,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C
1 µA
Common-mode Reject Ratio-Nom
80 dB
78 dB
Frequency Compensation
YES
Input Offset Voltage-Max
8000 µV
8000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-N8
JESD-609 Code
e3
Length
4.9 mm
3 mm
Low-Bias
NO
Low-Offset
NO
Micropower
NO
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-17.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
Number of Functions
2
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVSON
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Slew Rate-Nom
18 V/us
10 V/us
Supply Current-Max
5.6 mA
Supply Voltage Limit-Max
17.5 V
6.5 V
Supply Voltage-Nom (Vsup)
5 V
2.5 V
Surface Mount
YES
YES
Technology
BIPOLAR
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
16000
24000
Voltage Gain-Min
560
Wideband
NO
Width
3.9 mm
2 mm
Base Number Matches
2
1
Average Bias Current-Max (IIB)
0.005 µA
Seated Height-Max
0.8 mm
Compare LM7322MA/NOPB with alternatives
Compare MCP631-E/MNY with alternatives