LM70CILDX-3
vs
LM74CIBPX-3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
PLASTIC, LLP-8
MICRO, BGA-5
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
Accuracy-Max (Cel)
3.5 Cel
3 Cel
Body Breadth
3 mm
1.56 mm
Body Height
0.8 mm
0.9 mm
Body Length or Diameter
3 mm
1.61 mm
Housing
PLASTIC
PLASTIC
JESD-609 Code
e0
e0
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Bits
11
13
Number of Terminals
8
5
Operating Current-Max
0.49 mA
0.52 mA
Operating Temperature-Max
150 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Interface Type
3-WIRE INTERFACE
3-WIRE INTERFACE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Equivalence Code
SOLCC8,.11,20
BGA5,2X3,20
Package Shape/Style
SQUARE
RECTANGULAR
Sensors/Transducers Type
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.65 V
2.65 V
Surface Mount
YES
YES
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn63Pb37)
Termination Type
SOLDER
SOLDER
Base Number Matches
2
1
Compare LM70CILDX-3 with alternatives
Compare LM74CIBPX-3 with alternatives