LM56BIM vs LM56CIM feature comparison

LM56BIM National Semiconductor Corporation

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LM56CIM National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description 0.150 INCH, PLASTIC, SOP-8 0.150 INCH, PLASTIC, SOP-8
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Accuracy-Max (Cel) 3 Cel 4 Cel
Body Breadth 3.9 mm 3.9 mm
Body Height 1.54 mm 1.54 mm
Body Length or Diameter 4.89 mm 4.89 mm
Housing PLASTIC PLASTIC
JESD-609 Code e0 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 8 8
Operating Current-Max 0.23 mA 0.23 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape/Style RECTANGULAR RECTANGULAR
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,DUAL TRIP POINT TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,DUAL TRIP POINT
Supply Voltage-Max 10 V 10 V
Supply Voltage-Min 2.7 V 2.7 V
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Termination Type SOLDER SOLDER
Base Number Matches 2 2

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