LM4949TL
vs
LM4949TLX/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
VFBGA, BGA25,5X5,20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Bandwidth-Nom |
20 kHz
|
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| JESD-30 Code |
S-XBGA-B25
|
S-PBGA-B25
|
| JESD-609 Code |
e1
|
e1
|
| Length |
2.7 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
25
|
25
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
2.5 W
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
FBGA
|
| Package Equivalence Code |
BGA25,5X5,20
|
BGA25,5X5,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.6 mm
|
|
| Supply Current-Max |
10.9 mA
|
10.9 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
2.7 mm
|
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare LM4949TL with alternatives
Compare LM4949TLX/NOPB with alternatives