LM4890IBP/NOPB
vs
TPA701DGNRG4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Package Description
VFBGA,
HTSSOP, TSSOP8,.19
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Bandwidth-Nom
20 kHz
4 kHz
Consumer IC Type
AUDIO AMPLIFIER
AUDIO AMPLIFIER
Harmonic Distortion
2%
0.5%
JESD-30 Code
S-PBGA-B8
S-PDSO-G8
Length
1.361 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Power-Nom
1 W
0.7 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
HTSSOP
Package Equivalence Code
BGA8,3X3,20
TSSOP8,.19
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.95 mm
1.1 mm
Supply Current-Max
10 mA
0.25 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.2 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
BOTTOM
DUAL
Width
1.361 mm
3 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
MSOP
Pin Count
8
JESD-609 Code
e4
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
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