LM4871LD
vs
LM4895IBPX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
HVSSON, SOLCC8,.15,32
|
MICRO, SMD-9
|
| Pin Count |
8
|
9
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Bandwidth-Nom |
20 kHz
|
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| JESD-30 Code |
S-XDSO-N8
|
R-PBGA-B9
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4 mm
|
1.361 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
3 W
|
1 W
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSSON
|
VFBGA
|
| Package Equivalence Code |
SOLCC8,.15,32
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
0.8 mm
|
0.95 mm
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
40
|
| Width |
4 mm
|
1.336 mm
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
Yes
|
| Gain |
|
6 dB
|
| Harmonic Distortion |
|
1%
|
|
|
|
Compare LM4871LD with alternatives