LM4856ITLX
vs
LM4852LQ/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
MICRO SMD-18
|
LLP-24
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| Additional Feature |
60 MILLI WATT POWER OUTPUT AT THE HANDSFREE SPEAKER
|
60 MILLI WATT POWER OUTPUT AT THE HANDSFREE SPEAKER
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| JESD-30 Code |
R-PBGA-B18
|
R-XQCC-N24
|
| JESD-609 Code |
e0
|
e3
|
| Length |
2.225 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Channels |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1.1 W
|
1.5 W
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
IBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA18,4X5,20/17
|
LCC24,.16X.2,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, INTERSTITIAL PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
12 mA
|
12 mA
|
| Supply Voltage-Max (Vsup) |
5 V
|
5 V
|
| Supply Voltage-Min (Vsup) |
2.6 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.866 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
1.996 mm
|
4 mm
|
| Base Number Matches |
2
|
1
|
| Seated Height-Max |
|
0.8 mm
|
|
|
|
Compare LM4856ITLX with alternatives
Compare LM4852LQ/NOPB with alternatives