LM4839LQX
vs
LM4838MTEX/NOPB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
VQCCN, LCC28,.2SQ,20
|
HTSSOP, TSSOP28,.25
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Channel Separation |
65 dB
|
65 dB
|
| Consumer IC Type |
TONE CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| JESD-30 Code |
S-CQCC-N28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
e3
|
| Length |
5 mm
|
9.7 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bands |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
HTSSOP
|
| Package Equivalence Code |
LCC28,.2SQ,20
|
TSSOP28,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
1.1 mm
|
| Supply Current-Max |
30 mA
|
30 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
5 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LM4839LQX with alternatives
Compare LM4838MTEX/NOPB with alternatives