LM4666SD
vs
LM4666SD/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LLP-14
|
GREEN, LLP-14
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
22 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
6 dB
|
6 dB
|
| Harmonic Distortion |
1%
|
1%
|
| JESD-30 Code |
R-PDSO-N14
|
R-PDSO-N14
|
| JESD-609 Code |
e0
|
e3
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1.2 W
|
1.2 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC14,.12,20
|
SOLCC14,.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SON
|
| Pin Count |
|
14
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Noise Figure-Nom |
|
83 dB
|
|
|
|