LM3S8730-IBZ50-A2
vs
LM3S8730-IBZ50
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
LUMINARY MICRO INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LFBGA, BGA108,12X12,32
|
|
| Pin Count |
108
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
32
|
|
| Clock Frequency-Max |
8.192 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B108
|
|
| JESD-609 Code |
e1
|
|
| Length |
10 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
32
|
|
| Number of Terminals |
108
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA108,12X12,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
65536
|
|
| ROM (words) |
131072
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.5 mm
|
|
| Speed |
50 MHz
|
|
| Supply Voltage-Max |
2.75 V
|
|
| Supply Voltage-Min |
2.5 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare LM3S8730-IBZ50-A2 with alternatives
Compare LM3S8730-IBZ50 with alternatives