LM3S8730-EQC50
vs
LM3S8730-IBZ50-A2T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LUMINARY MICRO INC
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Package Description |
|
LFBGA, BGA108,12X12,32
|
| Pin Count |
|
108
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
32
|
| Clock Frequency-Max |
|
8.192 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PBGA-B108
|
| JESD-609 Code |
|
e1
|
| Length |
|
10 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of I/O Lines |
|
32
|
| Number of Terminals |
|
108
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA108,12X12,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
65536
|
| ROM (words) |
|
131072
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.5 mm
|
| Speed |
|
50 MHz
|
| Supply Voltage-Max |
|
2.75 V
|
| Supply Voltage-Min |
|
2.5 V
|
| Supply Voltage-Nom |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|
Compare LM3S8730-EQC50 with alternatives
Compare LM3S8730-IBZ50-A2T with alternatives