LM3S612-IQN50
vs
LM3S612-EGZ50-C2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LUMINARY MICRO INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
,
|
HVQCCN, LCC48,.27SQ,20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
48
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
32
|
| CPU Family |
|
CORTEX-M3
|
| Clock Frequency-Max |
|
0.032 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQCC-N48
|
| Length |
|
6.875 mm
|
| Number of I/O Lines |
|
34
|
| Number of Terminals |
|
48
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC48,.27SQ,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
8192
|
| ROM (words) |
|
32768
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1 mm
|
| Speed |
|
50 MHz
|
| Supply Current-Max |
|
110 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3.3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
6.875 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|
Compare LM3S612-IQN50 with alternatives
Compare LM3S612-EGZ50-C2 with alternatives