LM3S2D93-IBZ80-A1
vs
LM3S2D93-IQC80-A0T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
LFBGA,
|
LFQFP,
|
Pin Count |
108
|
100
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
16.384 MHz
|
16.384 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B108
|
S-PQFP-G100
|
JESD-609 Code |
e1
|
|
Length |
10 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
67
|
67
|
Number of Terminals |
108
|
100
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.5 mm
|
1.6 mm
|
Speed |
80 MHz
|
80 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
10 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LM3S2D93-IBZ80-A1 with alternatives
Compare LM3S2D93-IQC80-A0T with alternatives