LM3S2B93-IBZ80-C3T vs LM3S9B96-IBZ80-C3 feature comparison

LM3S2B93-IBZ80-C3T Texas Instruments

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LM3S9B96-IBZ80-C3 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LFBGA, BGA108,12X12,32 LFBGA, BGA108,12X12,32
Pin Count 108 108
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Bit Size 32 32
Clock Frequency-Max 50 MHz 80 MHz
DAC Channels NO NO
DMA Channels YES NO
JESD-30 Code S-PBGA-B108 S-PBGA-B108
JESD-609 Code e1 e1
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 67 65
Number of Terminals 108 108
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA108,12X12,32 BGA108,12X12,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 98304 98304
ROM (words) 262144 262144
ROM Programmability FLASH FLASH
Seated Height-Max 1.5 mm 1.5 mm
Speed 80 MHz 80 MHz
Supply Voltage-Max 1.32 V 3.6 V
Supply Voltage-Min 1.08 V 3.3 V
Supply Voltage-Nom 1.2 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER, RISC
Base Number Matches 1 1
Samacsys Manufacturer Texas Instruments
Address Bus Width
External Data Bus Width

Compare LM3S2B93-IBZ80-C3T with alternatives

Compare LM3S9B96-IBZ80-C3 with alternatives