LM3S2950-IBZ50-A2
vs
LM3S2950-IBZ50(T)
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
LUMINARY MICRO INC
Part Package Code
BGA
Package Description
GREEN, MO-219F, BGA-108
,
Pin Count
108
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
Additional Feature
ALSO REQUIRES 3.3 V IO SUPPLY
Address Bus Width
Bit Size
32
Clock Frequency-Max
50 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PBGA-B108
JESD-609 Code
e1
Length
10 mm
Moisture Sensitivity Level
3
Number of I/O Lines
60
Number of Terminals
108
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Equivalence Code
BGA108,12X12,32
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
65536
ROM (words)
262144
ROM Programmability
FLASH
Seated Height-Max
1.5 mm
Speed
50 MHz
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.5 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Base Number Matches
2
1
Compare LM3S2950-IBZ50-A2 with alternatives
Compare LM3S2950-IBZ50(T) with alternatives