LM3S1H11-IBZ50-A1 vs LM3S1811-IBZ50-C3 feature comparison

LM3S1H11-IBZ50-A1 Texas Instruments

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LM3S1811-IBZ50-C3 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LFBGA, MO-219F, NFBGA-108
Pin Count 108 108
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 16.384 MHz 16 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PBGA-B108 S-PBGA-B108
Length 10 mm 10 mm
Number of I/O Lines 67 67
Number of Terminals 108 108
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
ROM Programmability FLASH FLASH
Seated Height-Max 1.5 mm 1.5 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code BGA108,12X12,32
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 32768
ROM (words) 262144
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

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