LM387N vs LM386MX-1 feature comparison

LM387N Philips Semiconductors

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LM386MX-1 National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Package Description DIP-8 SOIC-8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Consumer IC Type AUDIO PREAMPLIFIER AUDIO AMPLIFIER
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e0 e0
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 5 2
Bandwidth-Nom 300 kHz
Gain 46 dB
Harmonic Distortion 10%
Length 4.9 mm
Moisture Sensitivity Level 1
Number of Channels 1
Number of Functions 1
Output Power-Nom 0.325 W
Peak Reflow Temperature (Cel) 235
Seated Height-Max 1.75 mm
Supply Current-Max 8 mA
Supply Voltage-Max (Vsup) 12 V
Supply Voltage-Min (Vsup) 4 V
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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