LM385BCOA-1.2723
vs
ISL21009BFB850Z-TK
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
INTERSIL CORP
|
Reach Compliance Code |
unknown
|
compliant
|
Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
THREE TERMINAL VOLTAGE REFERENCE
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Voltage-Max |
1.247 V
|
5.005 V
|
Output Voltage-Min |
1.223 V
|
4.995 V
|
Output Voltage-Nom |
1.235 V
|
5 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max (Isup) |
20 mA
|
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Temp Coef of Voltage-Max |
100 ppm/°C
|
3 ppm/°C
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Trim/Adjustable Output |
NO
|
YES
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Package Description |
|
SOP, SOP8,.25
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e3
|
Length |
|
4.9 mm
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
SOP8,.25
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
|
16.5 V
|
Supply Voltage-Min (Vsup) |
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
|
10 V
|
Terminal Finish |
|
MATTE TIN
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Voltage Tolerance-Max |
|
0.01%
|
Width |
|
3.9 mm
|
|
|
|
Compare LM385BCOA-1.2723 with alternatives
Compare ISL21009BFB850Z-TK with alternatives