LM358YD vs LM358D feature comparison

LM358YD STMicroelectronics

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LM358D Samsung Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description SOP, SOP8,.25 SOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.2 µA 0.5 µA
Bias Current-Max (IIB) @25C 0.15 µA 0.25 µA
Common-mode Reject Ratio-Nom 85 dB 100 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e0
Length 4.9 mm 4.9 mm
Low-Offset NO NO
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Slew Rate-Min 0.3 V/us
Slew Rate-Nom 0.6 V/us
Supply Current-Max 2 mA 2 mA
Supply Voltage Limit-Max 32 V 36 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1100
Voltage Gain-Min 25000 15000
Width 3.9 mm 3.9 mm
Base Number Matches 1 10
Common-mode Reject Ratio-Min 65 dB
Low-Bias NO
Micropower NO
Power NO
Programmable Power NO
Wideband NO

Compare LM358YD with alternatives

Compare LM358D with alternatives