LM358YD
vs
LM358D
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP8,.25
SOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.2 µA
0.5 µA
Bias Current-Max (IIB) @25C
0.15 µA
0.25 µA
Common-mode Reject Ratio-Nom
85 dB
100 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
9000 µV
9000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e0
Length
4.9 mm
4.9 mm
Low-Offset
NO
NO
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1.75 mm
1.75 mm
Slew Rate-Min
0.3 V/us
Slew Rate-Nom
0.6 V/us
Supply Current-Max
2 mA
2 mA
Supply Voltage Limit-Max
32 V
36 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Unity Gain BW-Nom
1100
Voltage Gain-Min
25000
15000
Width
3.9 mm
3.9 mm
Base Number Matches
1
10
Common-mode Reject Ratio-Min
65 dB
Low-Bias
NO
Micropower
NO
Power
NO
Programmable Power
NO
Wideband
NO
Compare LM358YD with alternatives
Compare LM358D with alternatives