LM339LVQPWRQ1
vs
LM339LVRTER
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TSSOP-14
|
WQFN-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2020-12-05
|
2020-12-05
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Bias Current-Max (IIB) @25C |
0.000005 µA
|
0.000005 µA
|
| Input Offset Voltage-Max |
2000 µV
|
2000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-N16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP14,.25
|
LCC16,.12SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR, 13 INCH
|
TR, 13 INCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Response Time-Nom |
600 ns
|
600 ns
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Supply Current-Max |
0.2 mA
|
0.2 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Temperature Grade |
|
AUTOMOTIVE
|
|
|
|