LM339AN
vs
LMV393MWC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
WAFER
|
| Package Description |
PLASTIC, DIP-14
|
DIE, WAFER
|
| Pin Count |
14
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.4 µA
|
0.25 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
0.25 µA
|
| Input Offset Voltage-Max |
4000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDIP-T14
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Length |
19.18 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP14,.3
|
WAFER
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
1300 ns
|
600 ns
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
2.5 mA
|
0.25 mA
|
| Supply Voltage Limit-Max |
36 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare LM339AN with alternatives
Compare LMV393MWC with alternatives