LM3303J
vs
MC3303N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP-14
Pin Count
14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
1 µA
Bias Current-Max (IIB) @25C
0.5 µA
0.5 µA
Common-mode Reject Ratio-Min
70 dB
Common-mode Reject Ratio-Nom
90 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
10000 µV
10000 µV
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Nom
0.6 V/us
Supply Current-Max
7 mA
7 mA
Supply Voltage Limit-Max
18 V
36 V
Supply Voltage-Nom (Vsup)
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1000
Voltage Gain-Min
20000
10000
Base Number Matches
2
6
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