LM324JP4
vs
LM324J
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
DIP, DIP14,.3
|
DIP, DIP14,.3
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
0.5 µA
|
|
Common-mode Reject Ratio-Min |
65 dB
|
|
Common-mode Reject Ratio-Nom |
80 dB
|
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
9000 µV
|
9000 µV
|
JESD-30 Code |
R-XDIP-T14
|
R-XDIP-T14
|
Low-Offset |
NO
|
NO
|
Micropower |
YES
|
YES
|
Number of Functions |
4
|
4
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Supply Current-Max |
3 mA
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Voltage Gain-Min |
15000
|
15000
|
Base Number Matches |
1
|
10
|
Bias Current-Max (IIB) @25C |
|
0.25 µA
|
JESD-609 Code |
|
e0
|
Power Supplies |
|
5/30 V
|
Qualification Status |
|
Not Qualified
|
Supply Voltage Limit-Max |
|
16 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare LM324JP4 with alternatives