LM324A
vs
LF147J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIE
DIP
Package Description
0.058 X 0.063 INCH, DIE-14
CERAMIC, DIP-14
Pin Count
14
14
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.2 µA
0.05 µA
Common-mode Reject Ratio-Min
65 dB
80 dB
Common-mode Reject Ratio-Nom
85 dB
100 dB
Input Offset Voltage-Max
5000 µV
8000 µV
JESD-30 Code
R-XUUC-N14
R-GDIP-T14
Micropower
NO
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
3 mA
11 mA
Supply Voltage-Nom (Vsup)
5 V
20 V
Surface Mount
YES
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Unity Gain BW-Nom
1000
4000
Voltage Gain-Min
25000
25000
Base Number Matches
4
3
Rohs Code
Architecture
VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C
0.0002 µA
Frequency Compensation
YES
Input Offset Current-Max (IIO)
0.025 µA
JESD-609 Code
e0
Length
19.304 mm
Low-Bias
YES
Low-Offset
NO
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-20 V
Package Equivalence Code
DIP14,.3
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
5.08 mm
Slew Rate-Min
8 V/us
Slew Rate-Nom
13 V/us
Supply Voltage Limit-Max
22 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
Compare LM324A with alternatives
Compare LF147J with alternatives