LM3207TLX
vs
LM3207TLX/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
VFBGA, BGA9,3X3,20
|
VFBGA, BGA9,3X3,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.7 V
|
2.7 V
|
| Input Voltage-Nom |
3.6 V
|
3.6 V
|
| JESD-30 Code |
S-XBGA-B9
|
S-PBGA-B9
|
| JESD-609 Code |
e1
|
e1
|
| Length |
1.97 mm
|
1.97 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Output Current-Max |
1.2 A
|
1.2 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA9,3X3,20
|
BGA9,3X3,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.675 mm
|
0.675 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
2300 kHz
|
2300 kHz
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
1.97 mm
|
1.97 mm
|
| Base Number Matches |
4
|
1
|
|
|
|