LM311H
vs
LM311DR2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MOTOROLA INC
|
| Part Package Code |
BCY
|
SOIC
|
| Package Description |
HERMETIC SEALED, METAL CAN-8
|
SOP, SOP8,.25
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.3 µA
|
0.3 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
|
| Input Offset Voltage-Max |
10000 µV
|
10000 µV
|
| JESD-30 Code |
O-MBCY-W8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Type |
OPEN-COLLECTOR
|
TOTEM POLE
|
| Package Body Material |
METAL
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
CAN8,.2
|
SOP8,.25
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
200 ns
|
200 ns
|
| Supply Voltage Limit-Max |
18 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
3
|
1
|
| Length |
|
4.9 mm
|
| Package Code |
|
SOP
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
3.9 mm
|
|
|
|
Compare LM311H with alternatives
Compare LM311DR2 with alternatives