LM308D
vs
LM108N
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
SIGNETICS CORP
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOP, SOP8,.25
|
,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.01 µA
|
0.003 µA
|
Bias Current-Max (IIB) @25C |
0.007 µA
|
|
Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
Frequency Compensation |
NO
|
|
Input Offset Voltage-Max |
10000 µV
|
3000 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e0
|
|
Length |
4.9 mm
|
|
Low-Offset |
NO
|
|
Neg Supply Voltage Limit-Max |
-18 V
|
-20 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage Limit-Max |
18 V
|
20 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Gain-Min |
15000
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare LM308D with alternatives
Compare LM108N with alternatives