LM2900DRE4
vs
MC3301P
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MOTOROLA INC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOP, SOP14,.25
|
DIP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.2 µA
|
0.3 µA
|
Bias Current-Max (IIB) @25C |
0.2 µA
|
|
Frequency Compensation |
YES
|
|
JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T14
|
JESD-609 Code |
e4
|
e0
|
Length |
8.65 mm
|
18.86 mm
|
Low-Offset |
NO
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
4
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Packing Method |
TAPE AND REEL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
4.69 mm
|
Slew Rate-Nom |
0.5 V/us
|
0.5 V/us
|
Supply Current-Max |
10 mA
|
14 mA
|
Supply Voltage Limit-Max |
36 V
|
28 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Unity Gain BW-Nom |
2500
|
4000
|
Voltage Gain-Min |
1200
|
1200
|
Width |
3.9 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare LM2900DRE4 with alternatives
Compare MC3301P with alternatives