LM258H/NOPB
vs
LM6161J-QMLV
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
BCY
|
DIP
|
| Package Description |
METAL CAN, TO-5, 8 PIN
|
CERAMIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.03 µA
|
6 µA
|
| Bias Current-Max (IIB) @25C |
0.15 µA
|
3 µA
|
| Common-mode Reject Ratio-Min |
70 dB
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
80 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
7000 µV
|
10000 µV
|
| JESD-30 Code |
O-MBCY-W8
|
R-GDIP-T8
|
| JESD-609 Code |
e1
|
e0
|
| Low-Offset |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-55 °C
|
| Package Body Material |
METAL
|
CERAMIC, GLASS-SEALED
|
| Package Code |
TO-5
|
DIP
|
| Package Equivalence Code |
CAN8,.2
|
DIP8,.3
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
2 mA
|
6.8 mA
|
| Supply Voltage Limit-Max |
32 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
THROUGH-HOLE
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Unity Gain BW-Nom |
1000
|
50000
|
| Voltage Gain-Min |
50000
|
300
|
| Base Number Matches |
2
|
2
|
| Packing Method |
|
RAIL
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
5.08 mm
|
| Slew Rate-Min |
|
180 V/us
|
| Slew Rate-Nom |
|
300 V/us
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare LM258H/NOPB with alternatives
Compare LM6161J-QMLV with alternatives