LM2575HVM-5.0/NOPB
vs
LM2574N-12/NOPB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Package Description |
SOIC-24
|
DIP, DIP8,.3
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
CAN ALSO CONFIGURED AS BUCK BOOST REGULATOR
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
60 V
|
40 V
|
Input Voltage-Min |
8 V
|
15 V
|
Input Voltage-Nom |
12 V
|
25 V
|
JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
15.4 mm
|
9.817 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
3.2 A
|
1.8 A
|
Output Voltage-Nom |
5 V
|
12 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
2.65 mm
|
5.08 mm
|
Surface Mount |
YES
|
NO
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
63 kHz
|
63 kHz
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
7.5 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Package Equivalence Code |
|
DIP8,.3
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max (Isup) |
|
10 mA
|
Technology |
|
BIPOLAR
|
|
|
|
Compare LM2575HVM-5.0/NOPB with alternatives
Compare LM2574N-12/NOPB with alternatives