LM239J vs LM339MWC feature comparison

LM239J General Electric Solid State

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LM339MWC Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP14,.3 DIE, DIE OR CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-XDIP-T14 X-XUUC-N
JESD-609 Code e0
Number of Functions 4 4
Number of Terminals 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -25 °C
Package Body Material CERAMIC UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP14,.3 DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Response Time-Nom 1300 ns 1300 ns
Supply Current-Max 2 mA 2.5 mA
Supply Voltage Limit-Max 36 V 36 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Base Number Matches 10 3
Average Bias Current-Max (IIB) 0.4 µA
Bias Current-Max (IIB) @25C 0.25 µA
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Output Type OPEN-COLLECTOR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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