LM239AJ
vs
933348560602
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RAYTHEON SEMICONDUCTOR
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
PLASTIC, SOT-27-1, DIP-14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Input Offset Voltage-Max
4000 µV
4000 µV
JESD-30 Code
R-XDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
1300 ns
1300 ns
Supply Current-Max
2 mA
Supply Voltage Limit-Max
36 V
36 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
8
1
Part Package Code
DIP
Pin Count
14
Average Bias Current-Max (IIB)
0.4 µA
Length
19.025 mm
Output Type
OPEN-COLLECTOR
Peak Reflow Temperature (Cel)
245
Seated Height-Max
4.2 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
7.62 mm
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