LM224J
vs
LM224D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
CERDIP-14
HERMETIC SEALED, DIP-14
Pin Count
14
14
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.3 µA
0.3 µA
Bias Current-Max (IIB) @25C
0.15 µA
Common-mode Reject Ratio-Min
70 dB
Common-mode Reject Ratio-Nom
85 dB
85 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
7000 µV
7000 µV
JESD-30 Code
R-GDIP-T14
R-CDIP-T14
JESD-609 Code
e0
e0
Length
19.43 mm
19.431 mm
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Slew Rate-Nom
0.5 V/us
Supply Current-Max
1.2 mA
3 mA
Supply Voltage Limit-Max
32 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
1000
1000
Voltage Gain-Min
50000
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Compare LM224J with alternatives
Compare LM224D with alternatives