LM224F
vs
LM224DG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
HALOGEN FREE AND ROHS COMPLIANT, SOIC-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.3 µA
|
0.3 µA
|
| Common-mode Reject Ratio-Min |
70 dB
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
| Input Offset Voltage-Max |
7000 µV
|
5000 µV
|
| JESD-30 Code |
R-GDIP-T14
|
R-PDSO-G14
|
| Length |
19.535 mm
|
8.65 mm
|
| Neg Supply Voltage Limit-Max |
|
-16 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Slew Rate-Nom |
0.3 V/us
|
0.6 V/us
|
| Supply Voltage Limit-Max |
32 V
|
16 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
1000
|
| Voltage Gain-Min |
50000
|
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LM224F with alternatives
Compare LM224DG with alternatives