LM219J vs LMC6772BIM feature comparison

LM219J National Semiconductor Corporation

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LMC6772BIM Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOIC-8
Pin Count 14 8
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 1 µA 4e-7 µA
Bias Current-Max (IIB) @25C 0.5 µA 4e-7 µA
Input Offset Voltage-Max 7000 µV 5000 µV
JESD-30 Code R-GDIP-T14 R-PDSO-G8
JESD-609 Code e0 e0
Length 19.304 mm 4.9 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 2 2
Number of Terminals 14 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Output Type OPEN-COLLECTOR OPEN-COLLECTOR; OPEN-DRAIN
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Response Time-Nom 80 ns 4000 ns
Seated Height-Max 5.08 mm 1.75 mm
Supply Current-Max 11.5 mA 0.02 mA
Supply Voltage Limit-Max 18 V 16 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 2 4
Pbfree Code Yes
Samacsys Manufacturer Texas Instruments
Packing Method TUBE

Compare LM219J with alternatives

Compare LMC6772BIM with alternatives