LM219F vs LMC6772BIN/NOPB feature comparison

LM219F Philips Semiconductors

Buy Now Datasheet

LMC6772BIN/NOPB Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description DIP-14 MDIP-8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Bias Current-Max (IIB) @25C 0.5 µA
Input Offset Voltage-Max 7000 µV 18000 µV
JESD-30 Code R-XDIP-T14 R-PDIP-T8
JESD-609 Code e0 e3
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 2 2
Number of Terminals 14 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified COMMERCIAL
Response Time-Nom 80 ns 4000 ns
Supply Current-Max 11.5 mA
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 3
Pbfree Code No
Part Package Code DIP
Pin Count 8
Length 9.817 mm
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Output Type OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Seated Height-Max 5.08 mm
Supply Voltage Limit-Max 16 V
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm