LM219D
vs
LM219FB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
SOIC
|
DFP
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14
|
DFP,
|
Pin Count |
14
|
10
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
1 µA
|
1 µA
|
Bias Current-Max (IIB) @25C |
0.5 µA
|
|
Input Offset Voltage-Max |
7000 µV
|
7000 µV
|
JESD-30 Code |
R-PDSO-G14
|
R-CDFP-F10
|
Length |
8.65 mm
|
|
Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR/OPEN-EMITTER
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOP
|
DFP
|
Package Equivalence Code |
SOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
80 ns
|
80 ns
|
Seated Height-Max |
1.75 mm
|
|
Supply Current-Max |
12.5 mA
|
11.5 mA
|
Supply Voltage Limit-Max |
18 V
|
18 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
|
Base Number Matches |
6
|
1
|
|
|
|
Compare LM219D with alternatives
Compare LM219FB with alternatives