LM193FE883B vs TLC372QDG4 feature comparison

LM193FE883B NXP Semiconductors

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TLC372QDG4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, GREEN, PLASTIC, MS-012AA, SOIC-8
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.3 µA 0.02 µA
Input Offset Voltage-Max 10000 µV 5000 µV
JESD-30 Code R-GDIP-T8 R-PDSO-G8
Length 9.955 mm 4.9 mm
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Type OPEN-COLLECTOR OPEN-DRAIN
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 1300 ns 650 ns
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage Limit-Max 36 V 18 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Rohs Code No
Samacsys Manufacturer Texas Instruments
Bias Current-Max (IIB) @25C 0.00003 µA
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Supply Current-Max 0.3 mA
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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