LM1881MX-X/NOPB
vs
EL1881CS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
Package Description
SOP, SOP8,.25
SOIC-8
Pin Count
8
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SYNC SEPARATOR IC
SYNC SEPARATOR IC
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
Length
4.9 mm
4.9 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Current-Max
12 mA
Supply Voltage-Max (Vsup)
12 V
Supply Voltage-Min (Vsup)
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
2
4
Factory Lead Time
4 Weeks
Date Of Intro
2017-09-26
Compare LM1881MX-X/NOPB with alternatives
Compare EL1881CS with alternatives