LM124D883B vs LM124J/883 feature comparison

LM124D883B AMD

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LM124J/883 National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIE DIP
Package Description DIE, DIP14,.3 CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Nom 85 dB 70 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 7000 µV
JESD-30 Code R-XUUC-N14 R-GDIP-T14
JESD-609 Code e0 e0
Low-Offset NO NO
Micropower YES YES
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B MIL-STD-883
Slew Rate-Nom 0.06 V/us 0.5 V/us
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position UPPER DUAL
Unity Gain BW-Nom 1000 1000
Base Number Matches 1 3
Average Bias Current-Max (IIB) 0.01 µA
Bias Current-Max (IIB) @25C 0.3 µA
Common-mode Reject Ratio-Min 70 dB
Length 19.43 mm
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Peak Reflow Temperature (Cel) 260
Seated Height-Max 5.08 mm
Supply Current-Max 1.2 mA
Supply Voltage Limit-Max 32 V
Time@Peak Reflow Temperature-Max (s) 40
Voltage Gain-Min 50000
Width 7.62 mm

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