LM119F883B
vs
LMC6772BIN/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
MDIP-8
Pin Count
14
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
1 µA
Input Offset Voltage-Max
7000 µV
18000 µV
JESD-30 Code
R-GDIP-T14
R-PDIP-T8
JESD-609 Code
e3/e4
e3
Length
19.535 mm
9.817 mm
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
2
2
Number of Terminals
14
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Type
OPEN-COLLECTOR
OPEN-DRAIN
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
COMMERCIAL
Response Time-Nom
80000 ns
4000 ns
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage Limit-Max
18 V
16 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN/NICKEL PALLADIUM GOLD
TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
3
Pbfree Code
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
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