LM119D883
vs
LMC6772QMM/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
1 µA
Input Offset Voltage-Max
7000 µV
13000 µV
JESD-30 Code
R-CDIP-T14
R-PDSO-G8
JESD-609 Code
e0
e3
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
2
2
Number of Terminals
14
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Output Type
OPEN-COLLECTOR/OPEN-EMITTER
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP14,.3
TSSOP8,.19
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
80 ns
Screening Level
MIL-STD-883
AEC-Q100
Supply Voltage Limit-Max
18 V
Supply Voltage-Nom (Vsup)
15 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.635 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Supply Current-Max
0.025 mA
Time@Peak Reflow Temperature-Max (s)
40
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