LM119/BCA
vs
LMC6772QMM
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
SOIC
Package Description
DIP,
TSSOP, TSSOP8,.19
Pin Count
14
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
1.5 µA
Input Offset Voltage-Max
7000 µV
13000 µV
JESD-30 Code
R-GDIP-T14
S-PDSO-G8
Length
19.43 mm
3 mm
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
2
2
Number of Terminals
14
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Type
OPEN-COLLECTOR
OPEN-DRAIN
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
80 ns
4000 ns
Seated Height-Max
5.08 mm
1.09 mm
Supply Current-Max
11.5 mA
0.025 mA
Supply Voltage Limit-Max
18 V
16 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
YES
Technology
BIPOLAR
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3 mm
Base Number Matches
3
2
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP8,.19
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
40
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