LM119/BCA vs LMC6772BIN feature comparison

LM119/BCA YAGEO Corporation

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LMC6772BIN National Semiconductor Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer PHILIPS COMPONENTS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description , DIP, DIP8,.3
Pin Count 14 8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 1 µA
Input Offset Voltage-Max 7000 µV 18000 µV
JESD-30 Code R-CDIP-T14 R-PDIP-T8
Neg Supply Voltage Limit-Max -18 V
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 2 2
Number of Terminals 14 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Type OPEN-COLLECTOR OPEN-DRAIN
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Response Time-Nom 80 ns 4000 ns
Supply Voltage Limit-Max 18 V 16 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Rohs Code No
JESD-609 Code e0
Length 9.817 mm
Moisture Sensitivity Level 1
Package Code DIP
Package Equivalence Code DIP8,.3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 5.08 mm
Supply Current-Max 0.025 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm

Compare LM119/BCA with alternatives

Compare LMC6772BIN with alternatives