LM111WRLQMLV
vs
UPC271G
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NEC ELECTRONICS CORP
|
Part Package Code |
DFP
|
SOIC
|
Package Description |
DFP, SOP10,.4
|
LSOP,
|
Pin Count |
10
|
8
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.15 µA
|
0.25 µA
|
Bias Current-Max (IIB) @25C |
0.1 µA
|
|
Input Offset Voltage-Max |
4000 µV
|
7500 µV
|
JESD-30 Code |
R-GDFP-F10
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage Limit-Max |
-18 V
|
-18 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
8
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
-20 °C
|
Output Type |
OPEN-COLLECTOR
|
TOTEM POLE
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
LSOP
|
Package Equivalence Code |
SOP10,.4
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
SMALL OUTLINE, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
200 ns
|
200 ns
|
Screening Level |
MIL-PRF-38535 Class V
|
|
Seated Height-Max |
2.032 mm
|
1.5 mm
|
Supply Current-Max |
6 mA
|
|
Supply Voltage Limit-Max |
18 V
|
18 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.25 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Total Dose |
50k Rad(Si) V
|
|
Width |
6.3 mm
|
4.4 mm
|
Base Number Matches |
2
|
1
|
Length |
|
5 mm
|
|
|
|
Compare LM111WRLQMLV with alternatives
Compare UPC271G with alternatives