LM111MD8
vs
LM111J-8LQMLV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIE
DIP
Package Description
DIE,
DIP, DIP8,.3
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.15 µA
0.15 µA
Bias Current-Max (IIB) @25C
0.1 µA
0.1 µA
Input Offset Voltage-Max
3000 µV
4000 µV
JESD-30 Code
X-XUUC-N
R-GDIP-T8
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
-18 V
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
1
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Type
OPEN-COLLECTOR; OPEN-DRAIN
OPEN-COLLECTOR
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
200 ns
200 ns
Supply Current-Max
6 mA
6 mA
Supply Voltage Limit-Max
18 V
18 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
2
2
Pin Count
8
JESD-609 Code
e0
Number of Terminals
8
Package Equivalence Code
DIP8,.3
Peak Reflow Temperature (Cel)
260
Screening Level
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
40
Total Dose
50k Rad(Si) V
Width
7.62 mm
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