LM111J-8RLQMLV vs LM311DR2 feature comparison

LM111J-8RLQMLV National Semiconductor Corporation

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LM311DR2 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code DIP SOIC
Package Description DIP, DIP8,.3 SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Amplifier Type COMPARATOR COMPARATOR
Average Bias Current-Max (IIB) 0.15 µA 0.3 µA
Bias Current-Max (IIB) @25C 0.1 µA
Input Offset Voltage-Max 4000 µV 10000 µV
JESD-30 Code R-GDIP-T8 R-PDSO-G8
JESD-609 Code e0 e0
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -18 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Type OPEN-COLLECTOR TOTEM POLE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Response Time-Nom 200 ns 200 ns
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 5.08 mm 1.75 mm
Supply Current-Max 6 mA
Supply Voltage Limit-Max 18 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Total Dose 50k Rad(Si) V
Width 7.62 mm 3.9 mm
Base Number Matches 2 5
Length 4.9 mm

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